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3 edition of Proceedings of the IEEE 2007 International Interconnect Technology Conference found in the catalog.

Proceedings of the IEEE 2007 International Interconnect Technology Conference

International Interconnect Technology Conference (2007 Burlingame, Calif.)

Proceedings of the IEEE 2007 International Interconnect Technology Conference

Burlingame, CA, June 4-6, 2007

by International Interconnect Technology Conference (2007 Burlingame, Calif.)

  • 280 Want to read
  • 36 Currently reading

Published by IEEE in Piscataway, NJ .
Written in English

    Subjects:
  • Interconnects (Integrated circuit technology) -- Congresses,
  • Semiconductors -- Design and construction -- Congresses

  • Edition Notes

    Other titlesIEEE 2007 International Interconnect Technology Conference, Proceedings of the 2007 10th anniversary IITC International Interconnect Technology Conference, 2007 IITC International Interconnect Technology Conference
    Statementsponsored by the IEEE Electron Devices Society.
    GenreCongresses.
    ContributionsIEEE Electron Devices Society.
    Classifications
    LC ClassificationsTK7874.53 .I64 2007
    The Physical Object
    Pagination215 p. :
    Number of Pages215
    ID Numbers
    Open LibraryOL18020704M
    ISBN 10142441069X
    LC Control Number2007921701

    Articles published in refereed international conference proceedings I. O'Connor, A. Kaiser, "Automated design of switched-current cells," Proc. Custom Integrated Circuits Conference, pp. , Santa-Clara (USA), May Use of this website signifies your agreement to the IEEE Terms and Conditions. A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology. Title IEEE Fifth International Conference on Communications and Electronics (ICCE ) Desc:Proceedings of a meeting held 30 July - 1 August , Danang, Vietnam. Prod#:CFPB-POD ISBN Pages (1 Vol) Format:Softcover Notes: Authorized distributor of all IEEE proceedings TOC:View Table of Contents Publ:Institute of Electrical and Electronics Engineers (IEEE .


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Proceedings of the IEEE 2007 International Interconnect Technology Conference by International Interconnect Technology Conference (2007 Burlingame, Calif.) Download PDF EPUB FB2

IEEE International Interconnect Technology Conference (IITC) The IITC conference will be held at the San Francisco Airport Hyatt Regency Hotel, conveniently located 20 minutes from both Silicon Valley and downtown San Francisco IEEE International Interconnect Technology Conference (IITC) 14edsqxd 3/23/07 PM Page 1File Size: 3MB.

IEEE Xplore. Delivering full text access to the world's highest quality technical literature in engineering and technology. IEEE Xplore - Conference Table of Contents. Get this from a library.

Proceedings of the IEEE International Interconnect Technology Conference: Hyatt Regency Hotel, Burlingame, CA, June[IEEE Electron Devices Society.;]. IEEE publishes more than 1, leading-edge conference proceedings every year, which are recognized by academia and industry worldwide as the most vital collection of consolidated published papers in electrical engineering, computer science, and related fields.

Electrical properties of carbon nanotube via interconnects fabricated by novel damascene process. In Proceedings of the IEEE International Interconnect Technology Conference - Digest of Technical Papers (pp.

[] (Proceedings of the IEEE International Interconnect Technology Conference - Digest of Technical Papers).Cited by: Get this from a library. IEEE International Interconnect Technology Conference IITC ; JuneHyatt Regency Hotel, Burlingame, CA ; 10th anniversary edition.

[IEEE Electron Devices Society;]. Santa Clara, California, USA 4 – 7 June IEEE Catalog Number: ISBN: CFP18ITR-POD IEEE International Interconnect TechnologyFile Size: 42KB.

An IEEE Conference Proceeding is the published collection of technical papers accepted for presentation at a conference. When preparing the conference proceedings you must set the pricing for the proceedings, gather content for the proceedings, follow IEEE guidelines for branding and trademarks, and prepare content for distribution to conference attendees.

Proceedings of the IEEE International Interconnect Technology Conference, IITC. Country: United States - SIR Ranking of Cites / Doc. (4 years) Cites / Doc. (3 years) Cites / Doc.

(3 years) (research articles, conference papers and reviews) in three year windows vs. those documents other than. IEEE Xplore. Delivering full text access to the world's highest quality technical literature in engineering and technology. IEEE websites place cookies on your device to give you the best user experience.

By using our websites, you agree to the placement of these cookies. Welcome to the International Conference on Computer-Aided Design (ICCAD), the world's premier conference in electronic design technology.

This 25th anniversary edition combines an exciting technical program in a new schedule format with an excellent tutorial program. Burlingame, California, USA 6 – 9 June IEEE Catalog Number: ISBN: CFP10ITR-PRT IEEE International Interconnect Technology.

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

Kumar, Rohit Sharma, Rizwan Bashirullah, Paul Kohl, and Azad Naeemi, “Compact Modeling and Performance Optimization of 3D Chip-Chip Interconnect Pathway with Transmission Lines, Vias and Discontinuities”, Proceedings of the 15 th IEEE International Interconnect Technology Conference, San Jose, June He is the co-editor (with James D.

Meindl) of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Artech House, ) and is the author/coauthor of more Proceedings of the IEEE 2007 International Interconnect Technology Conference book journal publications and conference proceedings, 14 US patents, and the presenter of 2 conference tutorials, including an invited tutorial on 3D.

KL Pey was the Guest Editor of IEEE Transactions on Devices in and Materials Reliability in andand the Chair of the Singapore IEEE REL/CPMT/ED Chapter in /05, and served on the /07/08 IRPS technical subcommittee, and the IPFA’02 to IPFA’06 and IPFA’08 technical committee, and the IEDM CMOS & Interconnect.

Proceedings of the IEEE International Interconnect Technology Conference, IITC Country: United States - SIR Ranking of United States: 6. H Index. International Collaboration accounts for the articles that have been produced by researchers from several countries.

The chart shows the ratio of a journal's documents signed by. Apsel and Z. Fu, “A Milliwatt SOS CMOS Receiver for Optical Interconnect”, Proceedings of the International Conference on Circuits and Systems, Vancouver, Canada, * T.

Yin, A. Apsel, A. Pappu, “Optical Interconnects for Commercial CMOS Computational Architecture”, SPIE. ICC - IEEE International Conference on Communications.

IEEE ICC is one of the two flagship IEEE conferences in the field of communications; Montreal is to host this conference in Each annual IEEE ICC conference typically attracts approximately 1, attendees, and will present over 1, research works over its duration.

In Interconnect Technology Conference, International, pp. – (). Besling, W. A., Broekaart, M. et al., “ Line resistance behavior in narrow lines patterned by a TiN hard mask spacer for 45 nm node interconnects.”.

Arti Joshi, Gaurav Soni () A Comparative Analysis of Copper and Carbon Nanotubes-Based Global Interconnects in 32 nm Technology. In: Pant M., Deep K., Bansal J., Nagar A., Das K. (eds) Proceedings of Fifth International Conference on Soft Computing for Problem Solving. Advances in Intelligent Systems and Computing, vol Springer, SingaporeAuthor: Arti Joshi, Gaurav Soni.

Jeffrey Alan Davis received his B.E.E., M.S.E.E., and Ph.D. from Georgia Tech in, andrespectively. Davis has co-authored over 75 refereed journal, conference, and workshop publications, and his papers have been referenced over times by researchers from around the world [].

He also co-authored and co-edited a book entitled. Power delivery, signaling and cooling for 2D and 3D integrated systems platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects,” Proceedings of the IEEE International Interconnect Technology Proceedings of the Electronic Component and Technology Conference Google Scholar.

M.S Author: Muhannad Bakir, Gang Huang, Bing Dang. Proceedings of the ACM/IEEE Conference on, Reno, NV, November, pp.

Kochar, A. Kodi and A. Louri, “ Implementation of Dynamic Bandwidth Re-allocation in Optical Interconnects using Microring Resonators,” in Proceedings of the 15th Annual IEEE Symposium on High-Performance Interconnects (HOTI ), Stanford, CA.

Zhang, L. Cao and P. Ho, “Grain Structure Effect on Electromigration of Cu Interconnects with CoWP Capping – A Statistical Model”, Proceedings of the IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM.

He has co-authored over technical papers in journals, conference proceedings and book chapters, edited 1 book, and holds US patents. He is currently the Chair for the Thermal Technical Working Group for the IEEE Electronics Packaging Society Roadmap effort on Heterogeneous Integration.

Vaseem, Z. Su, S. Yang, A. Shamim, "Fully Printed Flexible and Reconfigurable Antenna with Novel Phase Change VO2 Ink Based Switch," in IEEE International Flexible Electronics Technology Conference, Ottawa, Canada, Tugbawa, T., T.

Park, and D. Boning, “Integrated Chip-Scale Simulation of Pattern Dependencies in Copper Electroplating and Copper Chemical Mechanical Polishing Processes,” International Interconnect Technology Conference (IITC), San Francisco, CA, June “Bidirectional Interconnect Design for Low Latency High Bandwidth NoC.” in Proceedings of International Conference on IC Design and Technology (ICICDT’13), Pavia, Italy, May Based on Graph Theory.” in Proceedings of IEEE International Symposium on Information Theory (ISIT ), Nice, France, Jun Networks,” in.

Xiaoning Qi, S. Shen, Z. Hsiau, Z. Yu and R. Dutton, "Layout-based 3-D solid modeling of IC structures and interconnects including electrical parameter extraction," Proceedings of IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp.Sept. IEEE International Interconnect Technology Conference (IITC ) IEEE International Interconnect Technology Conference (IITC ) Share Post.

Facebook Twitter LinkedIn Mail. Add to Calendar. Find out what’s “elemental” in semiconductor materials at the Versum Materials booth at #IITC 17th International Conference on.

Wei and D. Edwards, "K-Means Like Minimum Mean Distance Algorithm for wireless sensor networks," International Conference on Computer Engineering and Technology (ICCET), pp. VV,V. Sipal, B. Allen, and D. Edwards, "Effects of antenna impulse response on wideband wireless channel," in Antennas and Propagation Conference (LAPC), Loughborough,pp.

Shannon Kurtas and Baris Taskin, "Statistical Timing Analysis of Nonzero Clock Skew Circuits", Proceedings of the IEEE International Conference on Midwest Circuits and Systems (MWSCAS), Augustpp.

Best student paper award nominee. PAPER. The edition of the ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED) welcomes you to Portland, Oregon also known as "The City of Roses" in the beautiful Pacific Northwest region of the USA. Michigan Technological University. Publications.

Note: Supervised students are delineated with an asterisk (*). Book Chapters [B1] Rasit Onur Topaloglu, Zhuo Feng and Peng Li, Interconnect variability and performance analysis, 18 pages, in Recent Advancements in Modeling of Semiconductor Processes, Circuits and Chip-Level Interactions (editor: Rasit Onur Topaloglu, co-editor: Peng Li.

Bakir is an editor of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems (with James D.

Meindl) and is the author/coauthor of more than journal publications and conference proceedings, 12 US patents, and the presenter of multiple international conference tutorials, including an invited tutorial on 3D IC and.

RapidIO - The Embedded System Interconnect brings together one essential volume on RapidIO interconnect technology, providing a major reference work for the evaluation and understanding of RapidIO.

Covering essential aspects of the specification, it also answers most usage questions from both hardware and software engineers. IEEE Electron Device Letters, Vol.

20, pp. –, Souri S, Saraswat K. Interconnect performance modeling for 3D integrated circuits with multiple Si layers. IEEE International Interconnect Technology Conference, pp.

24–26, Haskell B, Souri S, Helfand M. Varistor behavior at twin boundaries in ZnO. J. Provine, R. Kant, D.A. Horsley, and R.T. Howe, “Effect of a Vertical Stack of Aligned Subwavelength Metal Hole Arrays on Extraordinary Transmission Spectra,” Proceedings of the IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, Hualien, Taiwan, August, pp.

–   Ren et al., Proceedings of the IEEE International Interconnect Technology Conference, Santa Clara, CA, 4–7 June (IEEE, New York, ), p. Google Scholar. Visit us in Santa Clara at IITC - our marketing team will be there to discuss our offerings for low-k dielectrics, organometallics, and CMP/post-CMP.

Be sure to add Versum to your visit list!Singhal and E. Bozorgzadeh, "Novel multi-layer floorplanning for Heterogeneous FPGAs", in IEEE International Conference on Field Programmable Logic and Applications (FPL), pp.August C S.

Golshan and E. Bozorgzadeh, "Single-Event-Upset Awareness in FPGA Routing", in Proc. of ACM/IEEE Design Automation Conference (DAC), p. D. Prasad, and A. Naeemi, “Interconnect Design for Evolutionary and Revolutionary Transistor Technologies,” IEEE International Interconnect Technology Conference (IITC), Taiwan, May D.

Prasad, S. Sinha, B. Cline, S. Moore, and A. Naeemi, “A Novel Performance Model for State-of-art Processors by Modernization of Rent’s Rule.